SOLDERING FLUX AND SOLDER PASTE

摘要

The present invention provides a soldering flux which satisfies both an inhibition of heat-loosening and immersion-cleaning during a reflow process, and is able to inhibit the generation of differently shaped bumps as well as have a printing property and solder paste using the same. The present invention provides the soldering flux comprising: rosin-based resin; a solvent; an activator; and a thixotropic agent wherein the thixotropic agent includes hydrogenated castor oil and a dibenzylidene sorbitol compound.