METHOD OF FABRICATING INTERCONNECTION STRUCTURE

摘要

Disclosed is a method for forming a connection wiring structure. The method forms a first recess unit including a first nest shaped recess unit having a first line width on a dielectric layer and a first linear shaped recess unit having a second line width which is smaller than the first line width and forms a guide spacer layer on a side wall of the first recess unit to provide a second recess unit including a second nest shaped recess unit having a third line width which is smaller than the first line width. The method applies a self assembling block copolymer, and selectively removes a polymer block domain unit after inducing the formation of a polymer block matrix unit and a cylindrical polymer block domain unit surrounding the same by annealing the self assembling block copolymer. The method etches via cavity by using the polymer block matrix unit as an etching mask.