| 摘要 |
The purpose of the present invention is to provide a laminate film which has excellent heat resistance and stress relaxing properties and is suitable as a component member for a film that is used for the production of a semiconductor. The present invention relates to a laminate film (10) having a laminated structure composed of at least two layers including the outermost layer (6), wherein the outermost layer (6) comprises a thermoplastic resin composition containing a thermoplastic resin having a melting point of 98°C or higher, at least one layer (a second layer (3)) other than the outermost layer (6) comprises a resin composition containing an ethylene-(unsaturated carboxylic acid) copolymer having an unsaturated carboxylic acid content of 17 mass% or more or an ionomer of the copolymer. |
