发明名称 |
METHOD OF HERMETICALLY PACKAGING AN ELECTRONIC DEVICE |
摘要 |
A method of hermetically packaging an electronic device ( 8 ), in an enclosure ( 2 ) comprising mutually inter-engageable first and second housing members ( 4, 6 ), comprising the steps of securing the electronic device ( 8 ) to the first housing member ( 4 ), engaging the first ( 4 ) and second ( 6 ) housing members such that an hermetic seal is provided there between, wherein the engagement step is performed in a controlled atmosphere. The hermetic seal may be provided by an interference fit between the first ( 4 ) and second ( 6 ) housing members or via sealing means ( 16 ) interposed between the housing members ( 4, 6 ). The second housing member ( 6 ) may comprise an optical element ( 20 ), for example a window or lens. The packaging method is particularly applicable to packaging thermal detectors, for example microbolometer arrays. |
申请公布号 |
EP1552258(B1) |
申请公布日期 |
2016.03.09 |
申请号 |
EP20030791044 |
申请日期 |
2003.09.01 |
申请人 |
FLIR SYSTEMS TRADING BELGIUM |
发明人 |
KAUSHAL, TEJ PAUL;MANNING, PAUL ANTONY;GILLHAM, JOHN PETER;STACEY, GARY;POOLEY, DAVID MARTIN;LAITENBERGER, PETER GEORG |
分类号 |
G01J1/02;G01J5/20;B81B7/00;G01J1/04;G01J5/04;G01J5/08;G02B6/34;G02B6/42;H01L21/50;H01L23/10 |
主分类号 |
G01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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