METHOD OF MANUFACTURING COPPER FOIL WITH CARRIER, METHOD OF MANUFACTURING COPPER-CLAD LAMINATE, METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE, COPPER FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND ELECTRONIC DEVICE

摘要

Provided is a method for manufacturing a copper foil which has a carrier with excellent circuit formation on an ultrathin copper layer. Also, provided is a copper foil which has a carrier with excellent wettability on an etchant. Provided is a method for manufacturing a carrier-attached copper foil which includes a heating treatment process for performing a heating treatment on a surface treatment layer including a carrier, an interlayer, an ultrathin copper layer, and a silane coupling treatment layer with respect to a copper foil having a carrier provided in the same order for 1-6 hours at the heating temperature of 100-200°C or for 2-4 hours at the heating temperature of 160-220°C.