| 摘要 |
A light emitting device package with reliability according to an embodiment includes a light emitting device which includes a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, a first and a second lead frame which are separated from each other, a first and a second solder part which are respectively arranged on the first and the second lead frame, and a first and a second pad which are respectively arranged between the first and the second conductivity type semiconductor layer. At least one between the first and the second pad includes a rounding part. |
