| 摘要 |
PURPOSE:To form a superconducting wiring as the wiring on a printed board and eliminate the delay of switching speed of an electric circuit caused by the wiring resistance of the printed board by a method wherein a 1st superconducting wiring is formed on a 1st insulating substrate by printing and a superconducting wiring is formed on the end part of the 1st insulating substrate as a contact part. CONSTITUTION:A superconducting wiring 2 made of yttrium, barium, copper oxide or the like is applied to the surface of a ceramic insulating substrate 1 made of alumina or the like to form a superconducting wiring printed board. Also, a superconducting wiring is applied to the contact part 3 at the end part or in the through-hole of the insulating substrate 1. At that time, copper or gold plating may be applied to a part of the superconducting wiring or to the whole surface of the superconducting wiring and, if the superconducting wiring is made of organic material, a bakelite substrate or the like may be used as the insulating substrate. As the wiring resistance R of an electric circuit formed on the printed board is very low, the switching time constant tau=CR is very small so that a very high operation speed can be obtained. |
