发明名称 Cu−Ga合金スパッタリングターゲット、同スパッタリングターゲット用鋳造品及びこれらの製造方法
摘要 PROBLEM TO BE SOLVED: To provide a Cu-Ga alloy target with a Ga concentration range of 25-35 at%, which causes no cracks and has a decreased pore (a vacancy or a void).SOLUTION: A cylindrical Cu-Ga alloy sputtering target is produced by melting and casting at a melting temperature of the melting temperature of the alloy or 100°C more and 1100°C or less, preferably 1040°C or less, and at a vacuum degree of 5.0×10-2 torr or less, preferably 5.0×10torr or less. If the cylindrical sputtering target is sliced, it is obtained that the number of pores having a circle-equivalent diameter of 50 μm or more on a cross-sectional plane is 0.3 peaces/cmor less.
申请公布号 JP5882248(B2) 申请公布日期 2016.03.09
申请号 JP20130057482 申请日期 2013.03.21
申请人 JX金属株式会社 发明人 田村 友哉
分类号 C23C14/34;B22D21/00;B22D23/00;B22D29/00;C22C9/00;H01L21/363 主分类号 C23C14/34
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