| 摘要 |
PROBLEM TO BE SOLVED: To measure the height of a pointed bump of a semiconductor chip.SOLUTION: A surface illumination device 33 is disposed above a semiconductor wafer 21 on which a plurality of semiconductor chips including pointe bumps are formed, and the surface illumination device 33 illuminates the upper surface of the semiconductor wafer 21. A pair of imaging devices 34 and 35 are disposed obliquely above the semiconductor wafer 21 and capture images of the semiconductor chips including the pointed bumps on the semiconductor wafer 21 from the obliquely above position. A computer 36 detects the length of the pointed bump from the bottom to the tip end respectively on the basis of the pair of images captured by the pair of imaging devices 34 and 35, and calculates the height of the pointed bump using the detected pair of lengths and an angle formed between optical axes of the pair of imaging devices 34 and 35 and the upper face of the semiconductor waver 21. |
