| 摘要 |
A processing apparatus that performs processing to a wafer (9) is provided, the processing apparatus comprising a wafer chuck (8) disposed on a stage (6) and that holds the wafer (9); three pins (11a, 11b, and 11c) that attract the wafer (9) and move the wafer (9) from the wafer chuck (8); and a control unit (15) that is configured to stop or decrease the attraction of the three pins (11a, 11b, and 11c) based on information about a through hole (26) of the wafer (9) when the wafer (9) is moved from the wafer chuck (8) by the three pins (11a, 11b, and 11c). |
