ADHESIVE RESIN COMPOSITION

摘要

This invention relates to a photo-curing or electron beam-curing adherent resin composition being excellent in the adhesiveness to various adherends such as metal oxide, metal, resin and so on, and more particularly to an adherent resin composition of a photo-curing or electron beam-curing type comprising a difunctional urethane (metha)acrylate oligomer (A) and a monomer component (B), characterized in that the urethane (metha)acrylate oligomer includes a urethane prepolymer portion composed of a polyol and a polyisocyanate wherein repetitive number of urethane prepolymer portion (n) is 10-30, and the monomer component (B) is a cyclic monomer having a (metha)acryloyl group.