| 摘要 |
The present invention provides a semiconductor device which has a stable structure, and a manufacturing method thereof. The semiconductor device includes: a stacked structure including conductive films and insulation films which are alternately stacked; semiconductor patterns penetrating through the stacked structure; and contact plugs which are connected to the conductive films respectively. Each conductive film includes a first region having a first thickness, and a second region which is connected to the first region and has a second thickness thicker than the first thickness. A second region of a lower conductive film is located on a lower part of a second region of an upper conductive film. |
