SUBSTRATE TREATING APPARATUS AND SUPPORTING UNIT

摘要

The present invention provides a substrate processing device. According to an embodiment of the present invention, the substrate processing device includes: a housing having a space of processing a process on a substrate inside; a body supporting and rotating the substrate in the housing; a spin head having a chuck pin supporting the side of the substrate by protruding from the body to the upper part; and an injection unit injecting a treating liquid onto the substrate placed on the spin head. The chuck pin includes: a substrate support unit supporting the side of the substrate; and a head unit connected to the upper part of the substrate support unit. The head unit is formed to be inclined downwards in order for the lower part thereof to includes the substrate support unit when shown from the upper part. So, when the substrate to which the treating liquid is injected rotates, a scattering angle of the treating liquid can be controlled.