| 摘要 |
The present invention is to reduce grinding defects of a wafer by eliminating a grinding mark from a wafer. A wafer inspection method comprises the following steps of: polishing the wafer after grinding; photographing a processed surface of the wafer after grinding to generate photographing data including the characteristics of a plurality of grinding marks left on the processed surface of the wafer from the photographed image; and performing Fourier transform to the photographing data to extract frequency distribution showing the grinding marks, performing inverse Fourier transform to the extracted frequency distribution to obtain an amplitude of each grinding mark, and determining grinding defects of the wafer when the amplitude is greater than a predetermined amplitude. |
