发明名称 冷却装置
摘要 PROBLEM TO BE SOLVED: To provide a cooler in which temporary overheat of a heating element can be prevented, by making a liquefied heat-storage material leak from between a heat transfer substrate and the heat-storage material.SOLUTION: A cooler 100 includes a heat transfer substrate 11 having a heating element 1 attached to the first surface, and a heat-storage material 2 arranged on the second surface of the heat transfer substrate 11, and composed of a phase change material that is liquefied by absorbing heat. In the second surface of the heat transfer substrate 11, a groove 21 for guiding the liquefied heat-storage material and making it leak from the second surface is formed. Furthermore, the groove 21 formed in the second surface of the heat transfer substrate 11 extends to the outside of a container 3.
申请公布号 JP5881591(B2) 申请公布日期 2016.03.09
申请号 JP20120271259 申请日期 2012.12.12
申请人 三菱電機株式会社 发明人 千葉 博;中尾 英人;小林 裕;月舘 隆二;原田 裕紀;白井 靖朗
分类号 H01L23/42;H01L23/36;H01L23/40;H05K7/20 主分类号 H01L23/42
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