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发明名称
フリップチップ実装用半導体チップ
摘要
申请公布号
JP5880333(B2)
申请公布日期
2016.03.09
申请号
JP20120167218
申请日期
2012.07.27
申请人
三菱電機株式会社
发明人
加藤 隆幸
分类号
H01L23/12
主分类号
H01L23/12
代理机构
代理人
主权项
地址
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