| 摘要 |
Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm. |
