| 摘要 |
The present invention is to suppress bad influence on substrate surface processing according to remaining of a removal target, by removing the removal target from a rear surface of a substrate well. In the present invention, the substrate processing method (substrate processing system (1)) for removing the removal target of the rear surface of the substrate (5) has: a rear surface processing process (rear surface processing apparatus (10)) of supporting an outer circumference part of the substrate (5) by a substrate supporting body (34) using the rear surface of the substrate (5) as a top surface, and removing the removal target within a fixed processing range (50) to the vicinity of the substrate supporting body (34) from an inner circumference part of the rear surface of the substrate (5); and a rear surface edge part processing process (rear surface edge part processing apparatus (11)) of adsorbing and holding the inner circumference part of the rear surface of the substrate (5) using the rear surface of the substrate (5) as a bottom surface, and removing the removal target within a fixed processing range (7) at an inner circumference side from the outer circumference part of the rear surface of the substrate (5). After performing the rear surface edge part processing process, the substrate processing method performs inversion of the substrate, and then performs the rear surface processing process. |
