| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device that is configured by connecting a plurality of chips and that is capable of reducing a chip area (a mounting area) and cost of the solid-state imaging device by reducing a difference in size of the respective chips and of obtaining a high-quality image, and to provide a method of controlling the solid-state imaging device, and an imaging device. <P>SOLUTION: In a solid-state imaging device, a first substrate and a second substrate are electrically connected by a connector for electrically connecting the first substrate and the second substrate. A photoelectric conversion element is arranged in the first substrate. A reading circuit is arranged in the second substrate, and reads a signal generated at the photoelectric conversion element and passed through the connector. In a signal processing circuit having elements and circuits for performing signal processing to the readout signal, a part of the elements and circuits are arranged in the first substrate, and the remaining elements and circuits are arranged in the second substrate, and the elements and circuits arranged in the first substrate and the second substrate are electrically connected via the connector. <P>COPYRIGHT: (C)2013,JPO&INPIT |
