| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive for sealing a semiconductor capable suppressing generation of a void even when connection is performed at a high temperature of 300°C or higher in which a manufactured semiconductor has excellent connection reliability, and to provide a film-like adhesive for sealing a semiconductor using it, a manufacturing method for a semiconductor apparatus, and a semiconductor apparatus. <P>SOLUTION: The adhesive for sealing the semiconductor contains a compound formed by an epoxy resin (a), an organic acid (b) capable of reacting with the epoxy resin and a curing promoter. The adhesive further contains a polymer component (c) having a weight average molecular weight of 10,000 or more. The polymer component further contains a polyimide (d). <P>COPYRIGHT: (C)2010,JPO&INPIT |
