发明名称 |
SENSOR DEVICE AND ELECTRONIC APPARATUS |
摘要 |
(Object) To provide a sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved. (Solving Means) A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element.
The semiconductor element includes a first surface, a second surface, and a via-hole.
The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface.
The second surface incudes a second terminal for external connection and is an active surface.
The via-hole electrically connects the first surface and the second surface to each other. |
申请公布号 |
EP2993442(A1) |
申请公布日期 |
2016.03.09 |
申请号 |
EP20140791784 |
申请日期 |
2014.03.20 |
申请人 |
SONY CORPORATION |
发明人 |
KABASAWA, HIDETOSHI;OZAKI, HIROSHI;TAKAHASHI, KAZUO;MITANI, SATOSHI |
分类号 |
B81B7/00;B81C1/00;G01C19/5783;G01L9/12;G01P15/08;G01P15/14;H01L23/48;H01L25/16;H01L27/144;H01L29/84;H01L41/113 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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