| 摘要 |
A fluorescent layer forming device including a multistage forming mold according to the present invention comprises: a first tray formed in a shape corresponding to the fluorescent layer of a diode chip to be manufactured, accommodating a fluorescent material and having an accommodating hole formed to penetrate vertically; a second tray arranged below the first tray, corresponding to the accommodating hole and having an air flow hole formed to penetrate vertically; and a third tray arranged below the second tray and having an air supply groove formed to supply air to the air flow hole. A fluorescent layer forming method using the fluorescent layer forming device including the forming mold, which includes the first tray formed in the shape corresponding to the fluorescent layer of the diode chip to be manufactured, accommodating the fluorescent material and having the accommodating hole formed to penetrate vertically, the second tray arranged below the first tray, corresponding to the accommodating hole and having the air flow hole formed to penetrate vertically, and the third tray arranged below the second tray and having the air supply groove formed to supply the air to the air flow hole, comprises the steps of: inputting the fluorescent material into the accommodating hole; curing the fluorescent material; and releasing the cured fluorescent material from the accommodating hole. |
