| 摘要 |
Disclosed is a solder mask ink composition capable of being laminated using a digital printing method. The solder mask ink composition comprises: an epoxy resin; at least 20 wt% of a solvent with respect to the total weight of the solder mask ink composition; and an optionally non-ionic surfactant. Viscosity of the ink composition is less than or equal to 1,000 cps at a shear rate of 10 s^-1, and greater than or equal to 30 cps at a shear rate of 495 s^-1 and 25°C. |
