发明名称 METHOD FOR USING SPUTTERING TARGET AND METHOD FOR MANUFACTURING OXIDE FILM
摘要 A method for using a sputtering target which enables an oxide film with a high degree of crystallinity, which contains a plurality of metal elements, to be formed is provided. In the method for using a sputtering target including a polycrystalline oxide containing a plurality of crystal grains which include a cleavage plane, an ion is made to collide with the sputtering target to separate sputtered particles from the cleavage plane, and the sputtered particles are positively charged, so that the sputtered particles are deposited uniformly on a deposition surface while repelling each other.
申请公布号 EP2867387(A4) 申请公布日期 2016.03.09
申请号 EP20130810525 申请日期 2013.06.17
申请人 SEMICONDUCTOR ENERGY LABORATORY CO. LTD. 发明人 YAMAZAKI, SHUNPEI
分类号 C23C14/34;C23C14/08;C23C14/35;H01L21/363;H01L21/8247;H01L27/115;H01L51/50;H05B33/14 主分类号 C23C14/34
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