センサーデバイス、センサーモジュール、ロボット、センサーデバイスの製造方法

摘要

A sensor device includes a package, a sensor element that is disposed in the package, and a lid that seals the package, in which the sensor element includes a contacting surface that comes in contact with the lid, the package includes a joint surface which is joined to the lid, and the contacting surface and the joint surface are not on the same flat surface.