发明名称 積層電子部品およびその製造方法
摘要 PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component capable of efficiently making a plating film grow and having excellent productivity in a case where an external terminal electrode is formed on a surface of a ceramic element body by a direct plating method, and to provide a method for manufacturing the laminated ceramic electronic component.SOLUTION: Exposed portions 41c (42c) of an inner conductor exposed on a side surface 21 (22) of a ceramic element body 10 including laminated ceramic layers 50 and the inner conductor 41 (42), are connected to each other with a connection portion 41d present along a lamination direction of the ceramic layers, and an external terminal electrode contains a base plating film formed on the side surface by direct plating so as to cover the exposed portion of the inner conductor and the connection portion on the line. The connection portion is formed by polishing the side surface on which the inner conductor is exposed to extend the exposed portion of the inner conductor.
申请公布号 JP5880634(B2) 申请公布日期 2016.03.09
申请号 JP20140145221 申请日期 2014.07.15
申请人 株式会社村田製作所 发明人 谷 祐樹
分类号 H01G4/30;H01G4/12;H01G4/232 主分类号 H01G4/30
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