| 发明名称 | Integrated circuit component shielding | ||
| 摘要 | Embodiments of shielding apparatuses are disclosed herein. In some embodiments, a shielding apparatus may include first and second conductive regions and a plurality of vias disposed between the first and second conductive regions. The first and second conductive regions and the plurality of vias may surround an integrated circuit (IC) component and individual vias of the plurality of vias are spaced relative to one another to shield incoming or outgoing electromagnetic interference (EMI). Other embodiments may be described and/or claimed. | ||
| 申请公布号 | US9281281(B2) | 申请公布日期 | 2016.03.08 |
| 申请号 | US201414195661 | 申请日期 | 2014.03.03 |
| 申请人 | INTEL CORPORATION | 发明人 | Cowley Nicholas P.;Saraswat Ruchir |
| 分类号 | H01L23/552;H01L23/60;H01L23/48;H01L23/13;H01L23/66;H01L21/02 | 主分类号 | H01L23/552 |
| 代理机构 | Schwabe, Williamson & Wyatt, P.C. | 代理人 | Schwabe, Williamson & Wyatt, P.C. |
| 主权项 | 1. A shielding apparatus, comprising: first and second conductive regions; and a plurality of vias disposed between the first and second conductive regions; wherein the first and second conductive regions and the plurality of vias surround an integrated circuit (IC) component and individual vias of the plurality of vias are spaced relative to one another to shield incoming or outgoing electromagnetic interference (EMI). | ||
| 地址 | Santa Clara CA US | ||