| 发明名称 | Semiconductor package having overhang portion | ||
| 摘要 | A semiconductor package may include a substrate, and a structural body disposed over the substrate. The semiconductor package may include a semiconductor chip stacked over the structural body, and having an overhang portion projecting over a side surface of the structural body and overhanging out over the side surface of the structural body. The semiconductor package may include one or more bonding pads disposed on the overhang portion, and one or more wires electrically coupling the bonding pads to the substrate. The semiconductor package may include a wire fixing film attached onto the structural body, and overhanging out over the side surface of the structural body to fix the one or more wires. | ||
| 申请公布号 | US9281267(B1) | 申请公布日期 | 2016.03.08 |
| 申请号 | US201414549704 | 申请日期 | 2014.11.21 |
| 申请人 | SK Hynix Inc. | 发明人 | Jun Yong Tae |
| 分类号 | H01L23/52;H01L23/49;H01L23/498;H01L23/00 | 主分类号 | H01L23/52 |
| 代理机构 | William Park & Associates Ltd. | 代理人 | William Park & Associates Ltd. |
| 主权项 | 1. A semiconductor package comprising: a substrate; a structural body disposed over the substrate; a semiconductor chip stacked over the structural body, and having an overhang portion projecting over a side surface of the structural body and overhanging from the side surface of the structural body, one or more bonding pads disposed on the overhang portion; one or more wires electrically coupling the bonding pads to the substrate; a wire fixing film attached onto the structural body, and projecting over the side surface of the structural body and overhanging from the side surface of the structural body to fix the one or more wires, and wherein the semiconductor chip and the wire fixing film project over the same side surface of the structural body and overhang from the same side surface of the structural body. | ||
| 地址 | Gyeonggi-do KR | ||