发明名称 特に高性能処理装置用の電子カードのための液体冷却装置
摘要 Cooling device with liquid for electronic cards (16), in particular for high- performance processing units, comprising at least a hydraulic circuit (13) in which a heat-carrying fluid flows in order to extract the heat produced by electronic components (18) and/or hot spots (20) present on an associated electronic card (16). The device comprises a cooling plate (12) mechanically coupled to the electronic card (16) so as to be inserted in a containing rack (30) of the processing unit. The plate (12) has a heat extraction surface (24) facing and partly in contact, or at least in close proximity, with the electronic components (18) and/or the hot spots (20). The hydraulic circuit (13) is made in the thickness of the plate (12) and has a geometric grid development, along which a plurality of hydraulic sub-circuits (13a) are disposed and switching means (42) to define desired paths. The plate (12) has sliding guide means (15) able to cooperate with corresponding alignment means (31) of the containing rack (30),
申请公布号 JP5877834(B2) 申请公布日期 2016.03.08
申请号 JP20130521241 申请日期 2011.07.29
申请人 ユーロテック ソシエタ ペル アチオニ 发明人 ロッシ マウロ;テッキオッリ ジャンピエトロ;ズッカト ピエルフランチェスコ
分类号 H05K7/20;H01L23/473 主分类号 H05K7/20
代理机构 代理人
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