| 发明名称 | Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof | ||
| 摘要 | A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min. | ||
| 申请公布号 | US9281096(B2) | 申请公布日期 | 2016.03.08 |
| 申请号 | US201113806506 | 申请日期 | 2011.06.21 |
| 申请人 | DEXERIALS CORPORATION | 发明人 | Hayashi Shinichi;Hamachi Hiroshi |
| 分类号 | C09J9/02;H01B1/20;C08L23/08;C08L71/00;C09D167/00;C09J129/14;H01B1/22;H01R4/04;C09J123/08;C08K5/14;C08L63/10;C08L67/07;C08L75/16;C08L79/08 | 主分类号 | C09J9/02 |
| 代理机构 | Oliff PLC | 代理人 | Oliff PLC |
| 主权项 | 1. An anisotropic conductive material, comprising an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein a melt flow rate of the ethylene vinyl acetate copolymer according to Condition D of JIS-K7210 is not less than 400 g/10 min. | ||
| 地址 | Tokyo JP | ||