| 摘要 |
The objective of the invention is to provide a forming method of a wire distributing circuit. In forming, where a substrate is used as an object and a recessed part is formed on the upper surface of the substrate, of the wire distributing circuit based on painting and coating, productivity can be enhanced through a simple coating mechanism. When a step difference face circuit (13b) is formed from a step difference upper end part (12a) to a step difference lower end part (12b), a discharging mouth is allowed to discharge viscous body (P) while moving in the horizontal direction, and two ends are respectively formed in a suspended manner by the step difference upper end part (12a) and a wire-shaped body (P*) of the viscous body kept by the discharging mouth. Then, the viscous body (P) is stopped to be discharged, a joint part of the wire-shaped body (P*) and the discharging mouth is cut off, and the wire-shaped body (P*) is hung from the step difference upper end part (12a) and adhered to a step difference face (12). Thus, productivity is enhanced through the simple coating mechanism in the forming, where the substrate (3) is used as an object and a recessed part (10) is formed on the upper surface of the substrate, of the wire distributing circuit (13) based on painting and coating. |
