发明名称 |
Plasma processing method |
摘要 |
In a plasma processing method for plasma-etching magnetic layer by using a plasma processing device including a processing chamber in which a sample is plasma-processed, a dielectric window to seal an upper part of the processing chamber hermetically, an inductive coupling antenna disposed above the dielectric window, a radio-frequency power source to supply radio-frequency electric power to the inductive coupling antenna and a Faraday shield disposed between the inductive coupling antenna and the dielectric window, a deposit layer is formed on the plasma-etched magnetic layer by plasma processing while applying radio-frequency voltage to the Faraday shield after the magnetic layer is plasma-etched. |
申请公布号 |
US9281470(B2) |
申请公布日期 |
2016.03.08 |
申请号 |
US201414447614 |
申请日期 |
2014.07.31 |
申请人 |
Hitachi High-Technologies Corporation |
发明人 |
Abe Takahiro;Yamamoto Naohiro;Suyama Makoto;Ishimaru Masato |
分类号 |
H01L43/12 |
主分类号 |
H01L43/12 |
代理机构 |
Miles & Stockbridge P.C. |
代理人 |
Miles & Stockbridge P.C. |
主权项 |
1. A method of processing a laminate including a magnetic layer by using a plasma processing apparatus including a processing chamber in which a sample is plasma-processed, a dielectric window to seal an upper part of the processing chamber hermetically, an inductive coupling antenna disposed above the dielectric window, a radio-frequency power source to supply radio-frequency electric power to the inductive coupling antenna and a Faraday shield disposed between the inductive coupling antenna and the dielectric window, the method comprising the steps of:
plasma-etching the laminate while applying a first radio-frequency voltage to the Faraday shield to form a plasma-etched laminate, and forming a deposit layer on the plasma-etched laminate by plasma processing while applying a second radio-frequency voltage to the Faraday shield, wherein the second radio-frequency voltage is higher than the first radio-frequency voltage. |
地址 |
Tokyo JP |