ELECTRONIC COMPONENT MANUFACTURING METHOD AND FILM FORMING APPARATUS

摘要

The present invention provides an electronic component manufacturing method which can approximately uniformly perform a surface treatment on a surface of an electronic component by using a base material gas. The electronic component manufacturing method comprises: a process (S3) of accommodating an electronic component base body having a rectangular parallelepiped shape, a pair of end surfaces facing each other, a pair of side surfaces opposing each other and connecting the end surfaces, and a pair of principal surfaces connecting the end surfaces to be perpendicular to the end surfaces and the side surfaces in an accommodation unit of a component holder comprising the accommodation unit defining an accommodation space which can accommodate the electronic component base body; a process (S4) of bringing a base material gas containing an oleophobic material into contact with a surface of the electronic component base body accommodated in the accommodation unit to form an oleophobic film on the surface of the electronic component base body; a process (S5) of removing the electronic component base body on which the oleophobic film is formed from the accommodation unit; and a process (S6) of forming an outer electrode on the electronic component base body which is taken out.