| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of polishing a substrate under optimum polishing conditions for characteristics of a membrane for pressing a substrate such as a semiconductor wafer onto a polishing surface by inputting the characteristics of the membrane to the device.SOLUTION: The polishing device includes: a polishing table having a polishing surface; a membrane 4 that is an elastic film for forming pressure chambers 5, 6, and 7 to each of which a pressure fluid is supplied; a top ring 1 including a top ring main body 2 holding the membrane 4, and pressing a substrate onto the polishing surface by a fluid pressure by supplying the pressure fluid to each of the pressure chambers 5, 6, and 7; a measuring instrument measuring a longitudinal expansion amount of the membrane 4 in advance; and a control unit controlling respective units in the device. The control unit changes polishing conditions depending on the longitudinal expansion amount of the membrane 4 measured by the measuring instrument. |
