| 摘要 |
Disclosed is a process with comprises bringing an acidic organic substance or phosphoric acid into contact with a metal to form, on the surface of the metal, a layer that contains either an organic acid salt formed from both the acidic organic substance and the metal or a phosphoric acid salt formed from both the phosphoric acid and the metal. In the process, the layer can be selectively formed only on the surface of the metal. When the process is applied to the production of core-shell particles, neither agglomeration of the particles nor viscosity increase of the fluid occurs, while when the process is applied to the production of a covered metal-wiring circuit board, the layer can be selectively formed only in the metal area to be covered. |
