| 摘要 |
PROBLEM TO BE SOLVED: To provide a planarization device which allows for production of a thin and warpage-free substrate to which an extraneous matter does not adhere, by planarizing a sapphire substrate with high throughput.SOLUTION: A sapphire substrate is transferred between a grinder 30 including 3-axis grinding wheel heads 34h, 34h, and 34h, and a lapping machine 20 including two work suction heads 22, 22, by utilizing an arm 4a of a multi-articulated transfer robot 4. |
