发明名称 回路基板の製造方法
摘要 <P>PROBLEM TO BE SOLVED: To enable easy manufacturing and achieve the durability and the reliability even when multiple metal electrodes are formed by cutting metal foil in a circuit board. <P>SOLUTION: A circuit board 2 includes: a base material 3; multiple adhesion layers 4 formed on a base material surface 3a of the base material 3 so as to be spaced away from each other; and metal electrodes 5, each of which is formed at each adhesion layer 4. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5879754(B2) 申请公布日期 2016.03.08
申请号 JP20110126519 申请日期 2011.06.06
申请人 凸版印刷株式会社 发明人 工藤 茂樹;川崎 実;熊井 晃一
分类号 H01L31/049;H01L31/05 主分类号 H01L31/049
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