发明名称 |
Color filter layer and method of fabricating the same |
摘要 |
A method for fabricating a color filter layer, which is applied to an integrated circuit manufacturing process, includes the following steps. Firstly, a substrate is provided, and a groove structure is formed on the substrate. The groove structure includes a plurality of positive photoresist patterns and a plurality of trenches. Then, a first group of color filter patterns is formed in the trenches. The plurality of positive photoresist patterns is removed, so that a portion of a top surface of the substrate is exposed. Then, a second group of color filter patterns is formed on the exposed top surface of the substrate. |
申请公布号 |
US9279923(B2) |
申请公布日期 |
2016.03.08 |
申请号 |
US201313850297 |
申请日期 |
2013.03.26 |
申请人 |
UNITED MICROELECTRONICS CORPORATION |
发明人 |
Yu Cheng-Hung |
分类号 |
G02B5/22;G02B5/20;G03F7/00 |
主分类号 |
G02B5/22 |
代理机构 |
|
代理人 |
Tan Ding Yu |
主权项 |
1. A method for fabricating a color filter layer, comprising:
providing a substrate; forming a plurality of 3D patterns of positive photoresist composition; after forming the plurality of 3D patterns of positive photoresist composition, forming a first group of color filter patterns on the substrate and between at least two 3D patterns of positive photoresist composition, wherein the first group of color filter patterns comprises at least a first color 3D pattern of negative photoresist composition; after forming the first group of color filter patterns, removing the plurality of 3D patterns of positive photoresist composition so as to expose a portion of a top surface of the substrate; and forming a second group of color filter patterns on the exposed top surface of the substrate. |
地址 |
Hsinchu TW |