| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition in which adhesive layers are not adhered to each other when having been diced using a thin dicing blade, and that can achieve high package reliability even when having been exposed to a severe reflow condition, in a package mounted with a semiconductor chip to be thinned, and to provide an adhesive sheet having an adhesive layer formed from the adhesive composition, and a method for manufacturing a semiconductor device using the adhesive sheet.SOLUTION: An adhesive composition contains an acrylic polymer (A) having a weight average molecular weight (Mw) of 900,000 or more and a molecular weight distribution (Mw/Mn) of 3.9 or more and 7 or less, an epoxy resin (B) and a thermosetting agent (C). The adhesive composition is used in a step of die bonding a semiconductor chip, or a step of dicing a semiconductor wafer and die bonding a semiconductor chip. |
