| 摘要 |
[Problem] To provide: a mounting method for thermally compressing a chip having a fine solder bump such as a pillar bump formed thereon onto a substrate, whereby it becomes possible to determine whether or not the pillar bump is thermally compressed onto an electrode on the substrate satisfactorily; and a mounting device. [Solution] Provided is a mounting method comprising: a step of moving a chip downwardly on the substrate side while holding the chip by a thermal compression tool; a step of rising the temperature of the thermal compression tool that holds the chip thereon to a solder melting temperature after the contact of a pillar bump formed on the chip with an electrode formed on the substrate; a first reaction force measurement step of pushing the chip toward the substrate side by a predetermined indentation depth and measuring a reaction force from the electrode on the substrate upon the completion of the pushing; a second reaction force measurement step of measuring a reaction force from the electrode on the substrate upon the melting of a solder arranged on the pillar bump; and a reaction force determination step of determining the success or failure of the alignment of the molten pillar bump with the electrode from the measurement results obtained in the first reaction force measurement step and the measurement results obtained in the second reaction force measurement step. Also provided is a mounting device. |
