Current, temperature or electromagnetic field actuated fasteners

摘要

A method of bonding or debonding objects includes providing a first object including a first substrate with moveable features thereon which provide an actuated and a non-actuated state having different protrusion from the first substrate or a different curvature. A second object has an array of loops thereon. The moveable features while in one of the actuated state and non-actuated state are positioned, sized and shaped to fit within the loops. The moveable features include or are mechanically coupled to a material which responds to application of an actuating condition including electrical current, temperature, or an electromagnetic field by changing between the actuated state and the non-actuated state. Electrical current, temperature, or an electromagnetic field is automatically applied or changed to trigger a state change between the actuated state and non-actuated state that results in a bonding event or a debonding event between the first object and the second object.

主权项

1. A method of bonding or debonding objects, comprising:
providing a first object including a first substrate with a 2 dimensional (2D) array of moveable features thereon which each provide an actuated state and a non-actuated state, said movable features including engagers that are mechanically coupled to respective bimetallic spring coil actuators, said engagers having a protrusion from said first substrate in said actuated state that is different than said protrusion from said substrate in said non-actuated state, said bimetallic spring coil actuators responding to application of a change in temperature of said bimetallic spring coil actuator by changing between said actuated state and said non-actuated state, and a second object having a 2D array of loops on a second substrate, wherein said moveable features while in one of said actuated state and said non-actuated state are positioned, sized and shaped to fit within said array of loops; and automatically changing a magnitude of said temperature to trigger a state change between said actuated state and said non-actuated state, wherein said state change results in a bonding event or a debonding event between said first object and said second object.