| 摘要 |
When forming an external electrode of a stacked ceramic electronic component on a prescribed surface of a component main body by direct plating, adhesion between a plating film which becomes the external electrode and the component main body can be low, and water can infiltrate into an interface between the plating film and the component main body or an interface between a ceramic layer and an internal electrode. According to the present invention, a stacked ceramic electronic component (1) comprises: a component main body (5) comprising a ceramic layer (2) and an internal electrode (3, 4) containing Ni; and an external electrode (14, 15) formed on the component main body (5) by plating to be electrically connected to an exposure end (12, 13) of the internal electrode (3, 4). The internal electrode (3, 4) has an area (16) where Mg and Ni coexist. Since Mg-Ni oxide is formed in the Mg-Ni coexisting area (16), adhesion to the ceramic layer (2) is high, and the ceramic layer (2) and the internal electrode (3, 4) are not easily separated from each other at an interface between the ceramic layer (2) and the internal electrode (3, 4). |
