| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vapor deposition material capable of suppressing occurrence of a splash phenomenon and imparting a high gas-barrier property, a method for producing a vapor-deposited gas-barrier film using the vapor deposition material, and the vapor-deposited gas-barrier film deposited using the vapor deposition material. <P>SOLUTION: The vapor deposition material is a heating-type vapor deposition material comprising: a silicon metal powder; a silicon dioxide powder; and a copper metal powder or a copper oxide powder. The ratio of the number of oxygen atoms to the total number of silicon and copper atoms is within the range of 1.0-1.8, and the ratio of the number of copper atoms to the number of silicon atoms is ≥0.05. <P>COPYRIGHT: (C)2013,JPO&INPIT |
