发明名称 Liquid processing apparatus, liquid processing method and storage medium
摘要 Disclosed are a liquid processing device, and a liquid processing method. The liquid processing method includes a first process that includes supplying a first processing liquid to the substrate and discharging the first processing liquid within the processing space from a first discharge path, a second process that includes supplying a second processing liquid to the substrate and discharging the second processing liquid within the processing space from the second discharge path, and after stop supplying of the first processing liquid and prior to beginning of the second process, a nozzle switching operation switching from the first nozzle to the second nozzle and a discharge mechanism switching operation switching from the first discharge path to the second discharge path are performed. A longer one of a time to switch the nozzle and a time to switch the discharge mechanism is determined as a maximum preparation time and the switching operations begin at an earlier time than the completion time of the first process by the maximum preparation time or more.
申请公布号 US9281220(B2) 申请公布日期 2016.03.08
申请号 US201213649263 申请日期 2012.10.11
申请人 Tokyo Electron Limited 发明人 Takimoto Yuuji
分类号 H01L21/67 主分类号 H01L21/67
代理机构 Abelman, Frayne & Schwab 代理人 Abelman, Frayne & Schwab
主权项 1. A liquid processing apparatus, comprising: a substrate holding unit holding a substrate within a processing space; a first nozzle configured to supply a first processing liquid to the substrate held in the substrate holding unit; a second nozzle configured to supply a second processing liquid to the substrate held in the substrate holding unit; a discharge mechanism including a guide cup provided at an outer periphery of the substrate holding unit and capable of being switched between a first discharge path and a second discharge path, the guide cup being configured to move between a first position at which the processing space is connected with the first discharge path and a second position at which the processing space is connected with the second discharge path; and a control unit configured to control each of the substrate holding unit, the first nozzle, the second nozzle and the discharge mechanism, respectively, wherein the control unit is programmed to perform a first process that includes supplying the first processing liquid to the substrate held in the substrate holding unit and discharging the first processing liquid within the processing space from the first discharge path through the discharge mechanism, a second process, after the first process, that includes supplying the second processing liquid to the substrate held in the substrate holding unit and discharging the second processing liquid within the processing space from the second discharge path through the discharge mechanism, and after stop supplying of the first processing liquid in the first process and prior to beginning of the second process, a nozzle switching operation from the first nozzle to the second nozzle and a discharge mechanism switching operation from the first discharge path to the second discharge path, the control unit is further programmed to determine a longer one of a time required to perform the nozzle switching operation and a time required to perform the discharge mechanism switching operation as a maximum preparation time and begin the nozzle switching operation and the discharge mechanism switching operation at an earlier time than the completion time of the first process by the maximum preparation time or more such that both of the nozzle switching operation and the discharge mechanism switching operation are completed within the first process before the second processing liquid is supplied from the second nozzle in the second process, and the control unit is also programmed to dispose the guide cup at the first position in the first process and at the second position in the second process, and initiate moving the guide cup from the first position to the second position while the first process is being performed and complete moving the guide cup from the first position to the second position before the second process begins.
地址 Tokyo JP