| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin coating device and a resin coating method capable of increasing the production yield using an LED package manufacturing system by uniformly controlling the light-emitting property of an LED package even when the emission wavelength of each LED element is not uniform. <P>SOLUTION: The resin applying process is used for manufacturing a LED package that is covered by a resin 8 including a LED element 5. The light-emitting property of the resins 8, which are test-applied for measuring the light-emitting property, is measured while irradiating the resin 8 with the light from the top. A luminescent color correction processing is performed based on the measurement result every time when a predetermined interval has elapsed in an actual application to calculate a proper application amount of the resins to be applied to the LED element 5 in the actual manufacturing. <P>COPYRIGHT: (C)2013,JPO&INPIT |
