| 摘要 |
The invention provides an electronic component mounting method, which allows electronic components to mount in various cavities in normal posture even when a substrate is deformed. A plurality of referential marks (2m) arranged on the substrate are identified to calculate the positions of all referential marks (2m), Center positions of all cavities (3) detected based on the relative relation between the positions of all referential marks (2m) calculated and the center positions of the cavities (3) are coated with adhesives. The cavities (3) coated with adhesives are shot to obtain images, and electronic components (4) are mounted based on the obtained center positions of the adhesives in the cavities (3). |
