发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component.SOLUTION: According to an embodiment of the present invention, there can be provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes: a ceramic body in which a plurality of internal electrodes and a plurality of dielectric layers are stacked alternately in a thickness direction; and an external electrode including an electrode layer formed on an outer surface of the ceramic body to be connected to the internal electrodes, a conductive resin layer formed on the electrode layer and containing metal particles and a base resin, and a plating layer formed on the conductive resin layer. In the multilayer ceramic electronic component, in the case that a shortest distance from a point at which among the internal electrodes, an outermost internal electrode in the stacking direction and the electrode layer are connected to each other to an outer surface of the external electrode is defined as a, a length of a region of a virtual straight line passing through the conductive resin layer in assuming the straight line forming the shortest distance is defined as b, a length of a region of the straight line passing through the electrode layer is defined as c, and a sum of lengths of regions of the straight line passing through the metal particles contained in the conductive resin layer is defined as bm, 0.250≤{(2b+c)/a}×{1-(bm/b)}≤0.605 may be satisfied.SELECTED DRAWING: Figure 3
申请公布号 JP2016032091(A) 申请公布日期 2016.03.07
申请号 JP20140205448 申请日期 2014.10.06
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 AHN YON-GYU;YI BYON-HWA;PARK SAN-SOO;PARK HEUNG KIL;LEE SOON JU
分类号 H01G4/30;H01G4/228;H01G4/232;H01G4/252 主分类号 H01G4/30
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