发明名称 MANUFACTURING METHOD OF SUSPENSION SUBSTRATE WITH CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a suspension substrate with a circuit, capable of improving degree of freedom of material design of solder, and capable of ensuring stretch performance of a piezoelectric element.SOLUTION: A manufacturing method of a suspension substrate with a circuit includes: a first step of preparing a suspension substrate 3 that includes a support substrate 5, a base insulation layer 6 arranged on one surface in a thickness direction of the support substrate 5, and a conductor pattern 7 arranged on one surface in a thickness direction of the base insulation layer 6 and having a first terminal 28; a second step of connecting a piezoelectric element 2 to the first terminal 28 with solder 40, and heating the solder 40 at a depolarization temperature or more at which polarization of the piezoelectric element 2 starts dissipating; and a third step of applying voltage to the piezoelectric element 2 so that the piezoelectric element 2 connected to the first terminal 28 is polarized again.SELECTED DRAWING: Figure 5
申请公布号 JP2016031770(A) 申请公布日期 2016.03.07
申请号 JP20140153870 申请日期 2014.07.29
申请人 NITTO DENKO CORP 发明人 SAKAKURA TAKATOSHI;KANEKAWA HITONORI
分类号 G11B21/21;G11B21/10 主分类号 G11B21/21
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