| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation circuit board in which bondability of a heat dissipation layer is excellently maintained even in an environment in which temperature changes occur over a wide range.SOLUTION: The heat dissipation circuit board is provided which includes a substrate 10 made of ceramics and a heat dissipation layer 20 provided on at least one surface of the substrate 10. Such a heat dissipation layer 20 includes: a first heat dissipation layer 22 which contains copper as a main component and a glass component; and a second heat dissipation layer 24 which is provided on the surface of the first heat dissipation layer 22 and substantially formed with copper or a copper alloy.SELECTED DRAWING: Figure 1 |
