| 摘要 |
PROBLEM TO BE SOLVED: To provide: a thermal conductive silicone composition having excellent reworkability and long-term restorability while having low hardness; and a thermal conductive silicone molded product obtained by molding the composition into a sheet shape.SOLUTION: There is provided a thermal conductive silicone composition which comprises (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom at least in a molecular side chain in which the number of the alkenyl groups in the side chain is 2 to 9, (b) an organohydrogenpolysiloxane in which at least both terminals are blocked with hydrogen atoms directly bonded to silicon atoms, (c) a thermal conductive filler, (d) a platinum group metal curing catalyst and (e) an organic antioxidant and/or an inorganic antioxidant as an antioxidant, wherein when the average number of siloxane bonds between silicon atoms to which the alkenyl groups of the molecular side chain are directly bonded in (a) component is defined as (L) and the average degree of polymerization of (b) component is defined as (L'), L'/L=0.6 to 2.3 is satisfied.SELECTED DRAWING: None |
